BGA Reballing iPhone 11 - 11 Pro Max, BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip, Net Thickness Heat 0.12mm

BGA Reballing iPhone 11 – 11 Pro Max, BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip, Net Thickness Heat 0.12mm

50,38 lei

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BGA Reballing iPhone 11 – 11 Pro Max, BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip, Net Thickness Heat 0.12mm Produs de calitate superioara dintr-o gama a celor mai cunoscuti producatori din domeniu, testat de catre furnizor inainte de expediere.

Greutate 0,4 kg

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