BGA Reballing 3D BGA Reballing Stencil Kit for iPhone X, Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

BGA Reballing 3D BGA Reballing Stencil Kit for iPhone X, Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net

167,38 lei

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SKU: 53080
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BGA Reballing 3D BGA Reballing Stencil Kit for iPhone X, Motherboard Middle Layer Planting Tin Template Reballing Plate Soldering Net Produs de calitate superioara dintr-o gama a celor mai cunoscuti producatori din domeniu, testat de catre furnizor inainte de expediere.

Greutate 0,4 kg

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